Bujang: Chip-level DRAM recovery and testing

A failed DIMM is usually full of working chips. Bujang extracts DDR3 and DDR4 chips from failed modules, re-balls them, and validates each one electrically, so good DRAM goes back into use instead of scrap.

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10,000+

Chips recovered from failed DIMMs
100%

Of recovered chips electrically tested
> 95%

Accuracy in reball and inspection
Up to 60%

Savings versus new DRAM

Most ITAD and recovery operations discard failed memory modules without checking whether the chips inside still work. Traditional systems cannot rework BGA packages or run chip-level diagnostics, so a DIMM that fails functional testing is written off, however many good chips it holds.

Bujang is built for chip-level DRAM recovery. It extracts usable DDR3 and DDR4 chips, re-balls and reflows them on surface-mount rework stations, then validates each one with electrical tests that simulate real workloads. Good chips are logged, packed, and reused; bad ones are flagged and responsibly discarded.

Secure erasure Any residual data is wiped during validation when required.
Batch reporting Each chip is logged by batch with timestamps, and CSV reports are generated automatically.
Component traceability Reclaimed chips can be traced through production, packaging, and deployment.
QA integration Data feeds your inventory and quality workflows.

Every chip Bujang tests produces electrical performance logs that go far beyond pass or fail.

Yield optimization Track recovery by DIMM batch, failure type, or reball outcome.
Supplier comparison Compare DRAM performance by vendor or lot.
Defect patterns Spot anomalies that point to upstream process or packaging faults.
Design and QA feedback Improve module architecture and preventive screening.

How Bujang works

Harvest
Failed DIMMs are stripped and chips removed by precision de-soldering.
Refurbish
Chips are re-balled and reflowed for socket compatibility and electrical integrity.
Test
Each chip runs read and write cycles, voltage margin tests, and bit error analysis.
Sort and deploy
Chips are graded and reused, downcycled, or recycled.

Common questions

Can DRAM chips be reused safely after removal from a failed DIMM?

Yes. Every chip passes electrical validation, including read and write cycles, voltage tolerance, and error margin tests, before it is approved. Only chips that meet strict thresholds are redeployed, with trace logs for every batch.

Why recover chips instead of whole modules?

Most failed DIMMs are only partly damaged. Recovering the chips salvages value even when controller or trace damage makes the module itself unusable.

How is Bujang different from standard DIMM testers?

Standard tools test at module level. Bujang works at chip level, extracting, re-balling, and retesting individual DDR3 and DDR4 BGA chips, which is more precise and more circular.