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Bujang DRAM Chip-Level Recovery and Testing

Why DRAM recovery was always skipped

Most ITAD and recovery operations discard failed memory modules without ever checking if the chips inside are still usable. The reason? Lack of tools. 

Traditional systems can’t rework BGA packages or run chip-level diagnostics. If a DIMM fails functional testing, it’s written off, regardless of how many of the chips are still functional. 

That’s a lot of waste. And a lot of value left on the table. 

 

What Bujang recovers (that others miss)

Bujang is purpose-built for DRAM chip-level recovery. It extracts usable DDR3 and DDR4 chips from failed memory modules and brings them back into play. 

The system reballs and reflows BGA chips using surface mount rework stations, then validates each one with electrical tests that simulate real-world workloads. Good chips are logged, packed, and reused. Bad ones are flagged and responsibly discarded. 

It’s not about salvaging the whole DIMM. It’s about recovering what’s still valuable and traceable at the chip layer. 

Secure and traceable by design
  • Secure ErasureIf required, Bujang ensures any residual data is wiped during the validation process.
  • Batch-Level ReportingEach tested chip is logged by batch and timestamped, with CSV reports generated automatically.
  • Component-Level Traceability Reclaimed chips can be traced through production, packaging, and deployment.
  • QA System IntegrationData feeds into your inventory and quality assurance workflows.
Smarter recovery through DRAM test data

Every chip tested by Bujang generates electrical performance logs – data that goes far beyond pass/fail. That information becomes an asset for tuning thresholds, improving rework techniques, and benchmarking suppliers.

Yield Optimization
Track recovery rates by DIMM batch, failure type, or reballing outcome to refine upstream handling.

Supplier Comparison
Evaluate DRAM chip performance by vendor or lot to inform sourcing decisions.

Defect Pattern Recognition
Identify consistent anomalies that may signal upstream process issues or packaging faults.

Feedback to Design + QA
Use real-world test results to improve module architecture and preventive screening.

See Bujang for Yourself

Chips Recovered From Failed DIMMs

%

Electrically Tested Chips

> 95%

Accuracy In Reball + Inspection

Up to 60%

Savings Versus Virgin DRAM

Residue Post-Erasure Assurance

How Bujang turns failed DIMMs into usable DRAM

Harvest

01

Failed DIMMs are stripped and chips are removed using precision de-soldering.

Refurbish

02

Chips are re-balled and reflowed for socket compatibility and electrical integrity.

Test

03

Each chip undergoes read/write cycles, voltage margin tests, and bit error analysis.

Sort + Deploy

04

Chips are categorized by quality and either reused, downcycled, or recycled.

Common Deployment Questions

Can DRAM chips be reused safely after being removed from a failed DIMM?
Yes. Bujang subjects every chip to electrical validation – read/write cycles, voltage tolerance, and error margin tests – before it’s approved for reuse. Only chips that meet strict quality thresholds are redeployed, with full trace logs generated per batch.
Why not just recover the entire memory module instead of the chips?
Because most failed DIMMs have only partial damage. Recovering the chips lets you salvage value from otherwise scrapped modules, even when controller or trace damage makes the full module unusable.
What’s the difference between Bujang and standard DIMM testing tools?
Standard tools test modules at the DIMM level. Bujang works at the chip level. It can extract, reball, and retest individual DDR3/DDR4 BGA chips, which is far more precise, and far more circular.
How does Bujang integrate with existing QA and inventory systems?

It generates batch-level CSV reports with timestamps, electrical validation outcomes, and chip IDs. These reports can be imported into most ERP or QA systems to maintain traceability through refurbishment and resale.

What happens to chips that don’t pass testing?
They’re isolated and either downcycled or sent for responsible recycling. Nothing is reused unless it passes every required validation checkpoint.

Built to Work With

Optiline

AI-powered cosmetic grading that replaces human inspection with consistent, high-speed image recognition to deliver objective, data-driven evaluations at scale.

Titan

A scalable, automated test platform for customer premises equipment (modems, gateways, etc.) with up to 24 test slots and robotic loading/unloading.

Rackwipe

End-to-end, fully automated data erasure for data center racks — clearing drives, ports, switches, and sensitive configurations with detailed digital reporting.

Phoenix

An FPGA-based platform that rapidly tests DDR3/DDR4 memory modules in parallel — up to 10 at once — with deep diagnostics and real-time integration.

Maya

High-speed testing for NAND flash memory (BGA & TSOP) including advanced ECC verification and full protocol support — from SLC to 3D NAND.

Proteus

Our gold standard for HDD and SSD testing and data erasure, featuring ADISA Product Claims Tested erase functionality, flexible configurations (up to 64 test cells), and full audit trails.

RCU Tester

Automated remote control testing for IR, Bluetooth, buttons, LEDs, audio, and more — eliminating manual testing with scalable, fast-cycle execution.

ICT Tester

The ICT is an automated platform for in-circuit and functional testing of small control boards, enabling rapid changeover via swappable upper and lower test probes.

The PSUT

The PSUT platform delivers precise, customizable testing for power supply units, using advanced electronic loads and analytics to ensure reliability, compliance, and performance at scale.

Ready to start recovering DRAM?

Bujang lets you reclaim high-value DRAM chips from failed modules and turn memory scrap into reliable inventory. It’s the missing piece in your component-level recovery strategy.

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